Photoresist Database Available

Free photoresist database online - with hundreds of near UV resists, data sheets and regular updates

Photoresist Database


Following list contains common near UV (360 nm – 380 nm) photoresists used in semiconductor and MEMS manufacturing. The list is not exhaustive and is updated regularly. The photoresists are sub-grouped by common properties to: General Purpose Thin Film Photoresists, Thick Film Photoresist, Metal Lift-off Resists and Other Propose Resists and ordered in alphabetic order.
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General Purpose Thin Film Photoresists

SeriesProductsCharacteristicThinckness range [µm]ToneSens-itivity*Datasheet
AZ® 111 XFS PhotoresistAZ 111 XFSGeneral propose resists for wet etch applications with improved adhesion and reduced mask sticking0.8 to 1.4+h-iDatasheet
AZ® 1500 SeriesAZ 1505, AZ 1512, AZ 1518, AZ 1529General propose, resists for wet etch applications and plating0.4 to 4.0+g-h-iDatasheet
AZ® 1500-SFD SeriesAZ 1512-SFD, AZ 1518-SFDDyed versions of AZ® 1500, suppress reflectivity on metal surfaces1.2 to 3.0+g-h-iDatasheet
AZ® 3300 SeriesAZ 3312, AZ 3318-D, AZ 3350-HS, AZ 3322HS 2DGeneral purpose, crossover resists, thermally stable up to 125 °C1.0 to 2.5+g-h-iDatasheet
Datasheet
Datasheet
AZ® 3300-F SeriesAZ 3312-F, AZ 3330-FHigh speed version of AZ® 3300 series0.8 - 5.0+g-h-iDatasheet
Datasheet
AZ® 4999 PhotoresistAZ 4999Photoresist for spray coating applicationsNA+g-h-iDatasheet
AZ® 6600 SeriesAZ 6612, AZ 6615, AZ 6618-2DG, AZ 6624, AZ 6632General propose resists for wet and dry etch application1.0 to 4.5+g-h-iDatasheet
AZ® 8112 PhotoresistAZ 81123 to 4 times faster version of 111 XFS, used for scanning projection exposure1.0 to 1.7+h-iDatasheet
AZ® ECI 3000 SeriesAZ ECI 3007, AZ ECI 3012, AZ ECI 3027 Universal high resolution i-line/crossover photoresist series0.6 to 3.8+g-h-iDatasheet
AZ® HiR™ 1075 PhotoresistAZ HiR 1075Ultra-high resolution, L/S to 0.22 um, CH to 0.35 um0.6 to 1.2+iDatasheet
AZ® MiR™ 701 SeriesAZ MiR 701High resolution, fast, cost effective photoresists designed for replacement of older mid-range production resists. L/S to 0.35 um, CH to 0.4 um0.6 to 3.0+g-iDatasheet
Datasheet
AZ® MiR™ 703 SeriesAZ MiR 703, AZ MiR 703 (dyed)Mid range, fast, cost-effective photoresists designed for replacement of older mid-range and crossover production products. L/S to 0.4 um, CH to 0.5 um0.8 - 1.4+g-h-iDatasheet
Datasheet
AZ® MiR™ 900 PhotoresistAZ MiR 900High aspect ratio. L/S to 0.6 um2.0 to 4.5+iDatasheet
AZ® N4000 SeriesAZ N4035Non corrosive broadband photoresist with process latitude over 50% and high sensitivity 2.5 to 5.5-g-h-iDatasheet
AZ® N6000 SeriesAZ N6010, AZ N6020, AZ N6035, AZ N6070High speed, i-line photoresists for ion implant applications. L/S to 0.6 um0.6 to 10.0-iDatasheet
HNR SeriesHNR 80, HNR 120The resists with excellent adhesion resistance to “wet” etching solutions such as hydrofluoric or phosphoric/nitric acid mixtures and to plasma etching systems and .lower mask-to-wafer sticking tendencies during contact exposures0.6 to 1.5-g-iDatasheet
HPR 500 SeriesHPR 504, HPR 505, HPR 506Photoresists with good adhesion (may not require priming) for ion implant, wet and dry etching.1.2 to 3.3+g-hDatasheet
OiR 620 SeriesOiR 620-07, OiR 620-09, OiR 620-10Resists designed for ultra-high resolution with a robust process window for 0.30 µm production design rules for non-reflective substrates0.6 to 1.3+iDatasheet
OiR 674 SeriesOiR 674-09, OiR 674-11, OiR 674-14High throughput advanced i-line resist for patterns down to 0.35 um with superior performance on contact hole and TiN layers and vertical profiles and wide process latitude0.7 to 1.6+iDatasheet
OiR 906 SeriesOiR 906-12i, OiR 906-17iFast i-line photoresist with high performance in g-line and wide process latitude for patterns down to 0.4 um. Compatible with BARC’s and TiN substrates and comes in dyed versions with fast photospeed0.6 to 2.4+g-iDatasheet
OiR 907 SeriesOiR 907-12, OiR 907-17Ultrafast i-line resists with high performance in g-line and broadband with wide process latitude and zero bias. For patterns down to 0.5 um1.0 to 2.5+g-iDatasheet
OiR 908 SeriesOiR 908-12, OiR 908-17, OiR 908-35Crossover photoresist designed for high throughput biased applications with has excellent thermals, and good wet etch adhesion. For patterns down to 0.7 um1.0 to 5.0+g-iDatasheet
SC SeriesSC100, SC180, SC450General purpose thin film negative photoresist with excellent edge acuity resistant to a variaty of etchants including those commonly used to etch silicon2.0 to 6.0-g-iDatasheet
PR1 SeriesPR1-1000A, PR1-2000AGeneral purpose photoresist without HMDS requirement for etching, implantation and plating0.7 to 4.2+iDatasheet
ma-P 1200 Seriesma-P 1205, ma-P 1210, ma-P 1215, ma-P 1225, ma-P 1240Thin film photoresists for wet etch, dry etch, implantation and plating0.5 to 10+g-iDatasheet
MEGAPOSIT™ SPR™220 SeriesSPR220-1.2, SPR220-1.5, SPR220-3.0, SPR220-4.5, SPR220-7.0General purpose photoresists with excellent adhesion and plating characteristics for MEMS and bump processes. Applications: Cu, Au, NiFe1.0 to 30+g-iDatasheet
Datasheet
MEGAPOSIT™ SPR™3000 PhotoresistSPR3012, SPR3012L, SPR3015M, SPR3017General purpose photoresists for 0.6 um and larger with wide process latitude and high throughout0.8 - 1.7+g-h-iDatasheet
MEGAPOSIT™ SPR™660 SERIESSPR660-0.8, SPR660-1.0, SPR660-1.2, SPR660-1.5, SPR660-2.1, SPR660-3.0, SPR660L-1.0, SPR660M-0.6, SPR660M-1.5Advanced photoresists designed for 0.35 um and larger structures. Undyed and dyed versions available0.6 to 3.5+iDatasheet
MEGAPOSIT™ SPR™700 SERIESSPR700-0.8, SPR700-1.0, SPR700-1.2, SPR700-1.5, SPR700-1.8, Multi wavelength photoresists optimized to provide robust process latitudes and high throughput with excellent thermal stability0.6 - 2.8+g-iDatasheet
MEGAPOSIT™ SPR™955-CM SERIESSPR955-CM-0.7, SPR955-CM-0.9, SPR955-CM-1.1, SPR955-CM-1.4, SPR955-CM-1.8, SPR955-CM-2.1General purpose, high throughput photoresist for 0.35 um front-end and back-end processes0.6 to 3.0+iDatasheet
MICROPOSIT® S1800® SeriesS1805, S1811, S1813, S1813 J2, S1818, S1822General propose photoresists for advanced IC fabrication0.5 to 3.3+G-iDatasheet
ma-N 400 and ma-N 1400 Seriesma-N 405, ma-N 415, ma-N 420, ma-N 440, ma-N 490, ma-N 1405, ma-N 1407, ma-N 1410, ma-N 1420, ma-N 1440 Photoresists for wet etch, dry etch, implantation and lift-off0.5 to 10-iDatasheet


Thick Film Photoresist

SeriesProductsCharacteristicThinckness range [µm]ToneSens-itivity*Datasheet
AZ® 10XT SeriesAZ 10XTThick positive novolak photoresists for plating and etch applications. Application: Solder, Cu, Au5 to 50 (max. single coat 25)+G-H-iDatasheet
AZ® 125nXT SeriesAZ 125nXTUltra-thick negative photoresists for advanced packaging applications. Application: Cu, Au, Solder20 to 120-g-h-IDatasheet
AZ® 40XT SeriesAZ 40XT-11DChemically amplified positive tone thick photoresist for etch and plating applications. Application: Etch, Solder, Cu20 to 100 (max. single coat 60)+g-h-IDatasheet
AZ® 4500 SeriesAZ 4533, AZ 4562Thick film photoresists. Application: Solder, Cu, Au2.7 to 10.0+g-hDatasheet
AZ® 50XT SeriesAZ 50XTThick positive novolak photoresists for plating and etch applications. Application: Solder, Cu, Etch15 to 120 (max. single coat 65)+g-hDatasheet
AZ® 5nXT and 15nXT SeriesAZ 5nXT, AZ 15nXTChemically amplified thick film resists for Cu RDL, TSV, and other plating & etch applications5 to 20-g-h-IDatasheet
AZ® 5XT SeriesAZ 5XTThick film photoresists. Application: Si, Implant, Etch3.0 to 5.0+g-h-I
AZ® 9200 SeriesAZ 9245, AZ 9260High-resolution thick film resists. Application: Solder, Cu, Au3 to 50 (max. single coat 25)+G-H-iDatasheet
Datasheet
AZ® P4000 SeriesAZ P4620, AZ P4903, AZ P4330, AZ P4110, AZ P4210, AZ P4400Positive tone thick film photoresists. Application: Solder, Cu, Au2 to 55, (max. single coat 25)+g-hDatasheet
Datasheet
AZ® 12XT SeriesAZ12XTChemically amplified photoresist for Cu RDL and TSV applications. Application: Cu, Au, TSV5 to 20+g-h-IDatasheet
NR21 SeriesNR21-20000P18 to 200-i
NR4 SeriesNR4-8000P6.0 to 20-i
NR5 SeriesNR5-8000Thick film photoresist for DRIE, with temperature resistance up to 180 °C5.8 to 100-iDatasheet
PR1 SeriesPR1-4000A, PR1-12000AThick film photoresist with superior resolution, RIE selectivity and short process time for metal plating, implantation an RIE2.8 to 24.5+iDatasheet
JSR THB SeriesTHB 110N, THB 126N, THB 151N Thick photoresist for metal plating and bumping5 to 100-?Datasheet
ma-P 1275 Seriesma-P 1275, ma-P 1275 HVThick film resists designed for plating applications7.5 to 50+g-iDatasheet
KMPR 1000 SeriesKMPR 1005, KMPR 1010, KMPR 1025, KMPR 1035, KMPR 1050High contrast, epoxy based photoresist that can be developed in a conventional aqueous alkaline developer (TMAH) and readily stripped from the wafer4 to 120-g-h-IDatasheet
MEGAPOSIT™ SPR™220 SeriesSPR220-1.2, SPR220-1.5, SPR220-3.0, SPR220-4.5, SPR220-7.0General purpose photoresists with excellent adhesion and plating characteristics for MEMS and bump processes. Applications: Cu, Au, NiFe1.0 to 30+g-iDatasheet
Datasheet


Metal Lift-off Resists

SeriesProductsCharacteristicThinckness range [µm]ToneSens-itivity*Datasheet
AZ® 5214 E PhotoresistAZ 5214 EImage reversal photoresist for lift-off applications with adjustable sidewall angle1.1 to 2.0Image reversalh-iDatasheet
AZ® nLOF® 2000 SeriesAZ nLOF 2020, AZ nLOF 2035, AZ nLOF 2070I-line photoresists for metal lift-off applications. L/S to 0.7 um1.5 to 10.0-iDatasheet
AZ® nLOF® 5500 PhotoresistAZ nLOF 5510High resolution, i-line photoresist for metal lift-off applications. L/S to 0.22 um, CH to 0.35 um0.75 to 1.5-iDatasheet
NR7-PY SeriesNR7-1000PY, NR7-1500PY, NR7-3000PY, NR7-6000PYLift-off photoresists with negative profile, temperature resistance up to 180 °C and adjustable undercut0.7 to 25-iDatasheet
Datasheet
NR9-PY SeriesNR9-1000PY, NR9-1500PY, NR9-3000PY, NR9-6000PYLift-off photoresists with negative profile, enhanced adhesion and adjustable undercut0.7 to 12.2-iDatasheet
JSR NFR SeriesNFR 016 D2, NFR 111D2H, NFR 111D2HDatasheet
ma-N 400 and ma-N 1400 Seriesma-N 405, ma-N 415, ma-N 420, ma-N 440, ma-N 490, ma-N 1405, ma-N 1407, ma-N 1410, ma-N 1420, ma-N 1440 Photoresists for wet etch, dry etch, implantation and lift-off0.5 to 10-iDatasheet


Other Propose Resists

SeriesProductsCharacteristicThinckness range [µm]ToneSens-itivity*Datasheet
NANO™ SU-8 2000 SeriesSU-8 2000.5, SU-8 2002, SU-8 2005, SU-8 2007, SU-8 2010, SU-8 2015, SU-8 2025, SU-8 2035, SU-8 2050, SU-8 2075,SU-8 2100, SU-8 2150Improved formulation of SU-8, uses a faster drying, more polar solvent system resulting in improved coating quality and increases process throughput0.5 to > 200-g-h-iDatasheet
Datasheet
Datasheet
NANO™ SU-8 3000 SeriesSU-8 3005, SU-8 3050, SU-8 3010, SU-8 3025, SU-8 3035Improved formulation of SU-8, has been designed for improved adhesion and reduced coating stress4 to 120-g-h-iDatasheet
NANO™ SU-8 SeriesSU-8 2, SU-8 5, SU-8 10, SU-8 25, SU-8 50, SU-8 100 High contrast, epoxy based photoresists designed for micromachining and other microelectronic applications, where a thick, chemically and thermally stable image is desired1 to > 200-g-h-iDatasheet
Datasheet
JSR WPR SeriesWPR-1020, WPR-1050, WPR-12013 to 20-
NR71 SeriesNR71-250P, NR71-1000P, NR71-1500P, NR71-3000P, NR71-6000PPhotoresists designed for DRIE and ion milling application with temperature resistance up to 180 °C0.2 - 12.2-iDatasheet
NR9 SeriesNR9-250P, NR9-1000P, NR9-1500P, NR9-3000P, NR9-6000P, NR9-8000PPhotoresists with enhanced adhesion for wet etch applications0.2 to 100-iDatasheet

* Capital letter indicates preferred exposure wavelength. Letters correspond to mercury lamp peaks i-line = 365 nm, h-line = 405 nm, g-line = 436 nm
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